Recycled Materials and Lightweight Insulating Additions to Mixtures for 3D Concrete Printing (2025-09)¶

Three-dimensional concrete printing (3DCP) is advancing rapidly, yet its sustainable adoption requires alignment with circular-economy principles. This study evaluates the substitution of natural aggregates with recycled constituents, 3DCP waste, brick debris, glass cullet, mixed rubble, fly ash, and slag, and the use of lightweight fillers (expanded perlite, lightweight expanded clay aggregate (LECA), and expanded polystyrene (EPS)) to reduce density and improve insulation. Key properties, such as particle-size distribution, printability, mechanical performance, thermal conductivity, and water absorption, were determined. Results indicate that grading strongly affected mixture behavior. Narrow distributions (fly ash, milled 3DCP waste) enhanced extrudability, while broader gradings (glass, rubble, slag) increased water demand and extrusion risks. Despite these differences, all systems remained within the printable window: flow spread decreased with most recycled additions (lowest for brick) and increased with glass. Mechanical responses were composition-dependent. Flexural strength typically decreased. Compressive strength benefited from broader gradings, with replacement levels up to ~6% enhancing strength due to improved packing. Loading anisotropy typical of 3DCP was observed, with perpendicular compressive strength reaching up to 13% higher values than parallel loading. Lightweight fillers significantly reduced thermal conductivity. LECA provided the best compromise between strength and insulation, perlite showed intermediate behavior, and EPS achieved the lowest thermal conductivity but induced significant strength penalties due to weak matrix-EPS interfaces. Water absorption decreased in recycled-aggregate mixes, whereas lightweight systems, particularly with perlite, retained higher uptake. The results demonstrate that non-reactive recycled aggregates and lightweight insulating fillers can be successfully integrated into extrusion-based 3DCP without compromising printability.